The EyeScan AT 3D sensor – together with EyeVision image processing software can inspect the correct position of pins and check for the quality and position of balls on a Ball-Grid-Array. The connectors of BGAs can be inspected with the 3D sensor for various characteristics up to an accuracy of a micrometer (µm).

Thanks to the Scheimpflug-projection, the laser line stays focused and distortion-free. Even in a high-speed application, the captured images have a high resolution, and no lens distortion correction is needed. Every single bump of the BGA is inspected for its size and shape up to a µm-accuracy.

The EyeScan AT utilizes precision laser line measurement (or laser triangulation). The camera views a laser line, which is projected onto the component (in this case: the BGA) and calculates the height information from the laser line profile.

Utilizing a precision blue laser and on board FPGA the EyeScan AT 3D is capable of over 20,000 profiles per second with very high resolution to capture even the finest details. Additionally, the High Dynamic Range algorithm with threefold exposure allows inspection of bright and dark objects in the same scan without loss of speed.

3D image information is processed by the powerful EyeVision software which is programmed though an intuitive drag and drop interface.